NOWOFLON Semiconductor film
NOWOFLON Semiconductor release films has perfect characteristics to be used for FAM (film assisted molding).
- High heat resistance
- Can release the product from mold-die easily due to non-stick properties
- Can prevent burr/flash on lead frame or cavity-die
- Can follow the uneven surface of the cavity due to its good flexibility at molding temperature
- Can prevent package from breaking
- No need of ejector pin
- Suitable for all common molding machines
Depending on molding temperature, cavity design and machine parameters different kind of film types can be used.
50 and 100 µm
10 to 1300 mm depending on film type